Substrate processing apparatus and method of manufacturing semiconductor device

ABSTRACT

A stable and highly reliable device for detecting damage or contact failures of respective parts is provided. The device includes a processing chamber for processing a substrate; a heater for heating the substrate; a substrate support accommodating the heater and installed inside the processing chamber; a shaft for supporting the substrate support; a wire inserted through the shaft; a supporting unit for holding the wire; and a temperature detector connected to the supporting unit.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This U.S. non-provisional patent application claims priority under 35U.S.C. §119 of Japanese Patent Applications No. 2009-281531 filed onDec. 11, 2009 and No. 2010-233952 filed on Oct. 18, 2010, in theJapanese Patent Office, the entire contents of which are herebyincorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a substrate processing apparatus forprocessing a substrate using a heating device installed in a substratesupport and a method of manufacturing a semiconductor device.

2. Description of the Related Art

In the procedure of processing a substrate, the substrate is processedby heating the substrate to a predetermined temperature. Conventionally,a single substrate processing apparatus employs a heating device such asa lamp and an electric resistance heating device installed around asubstrate support for supporting the substrate to heat the substrate.

The electric resistance heating device is provided with a predeterminedelectric power by a power source for heating the same, and the substrateis then heated by a thermal conduction from the heated electricresistance heating device. However, when the apparatus is continuouslyoperated, the electric resistance heating device or other parts isdestroyed or deteriorated, which results in a contact failure.Therefore, the reliability of the apparatus may be notably deteriorated,for example, failing to heat the substrate to a desired temperature orfailing to heat the substrate at all.

SUMMARY OF THE INVENTION

In order to solve the above-described problems, the object of thepresent invention is to provide a stable and highly reliable substrateprocessing apparatus and a method of manufacturing a semiconductordevice which are free of unstable heating due to a damage or a contactfailures of respective parts.

According to one embodiment of the present invention, there is provideda substrate processing apparatus including: a processing chamberconfigured to process a substrate; a first heater and a second heaterconfigured to heat the substrate; a substrate support disposed in theprocessing chamber, the substrate support accommodating the heatertherein; a shaft supporting the substrate support; a first wire insertedthrough the shaft, the first wire including a first heater power supplyline, a first connection mechanism and a first heater wire having afirst end connected to the first heater and a second end connected tothe first heater power supply line via the first connection mechanism; asecond wire inserted through the shaft, the second wire including asecond heater power supply line, a second connection mechanism and asecond heater wire having a first end connected to the second heater anda second end connected to the second heater power supply line via thesecond connection mechanism; and a supporting unit including a firstpartition installed between the first heater power supply line and thesecond heater power supply line, the supporting unit holding the firstheater power supply line, the first connection mechanism, the secondheater power supply line and the second connection mechanism.

According to another embodiment of the present invention, there isprovided a method for manufacturing a semiconductor device using asubstrate processing apparatus, the apparatus including a processingchamber for processing a substrate; a heater for heating the substrate;a substrate support accommodating the heater and installed inside theprocessing chamber; a shaft for supporting the substrate support; a wireinserted through the shaft; a supporting unit for holding the wire; anda temperature detector connected to the supporting unit, the methodincluding steps of: (a) supporting the substrate by the substratesupport in the processing chamber; and (b) heating the substratesupported by the substrate support using the heater accommodated in thesubstrate support, and wherein the temperature detector detects atemperature of the supporting unit during the step (b).

According to the present invention, it is possible to provide a stableand highly reliable substrate processing apparatus which is free ofunstable heating due to damage or contact failures of respective parts,and a method of manufacturing a semiconductor device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a substrate processing apparatusaccording to an embodiment of the present invention.

FIG. 2 is a vertical cross-sectional view of a shaft of a substrateprocessing apparatus according to an embodiment of the presentinvention.

FIG. 3 is a horizontal cross-sectional view of the shaft of thesubstrate processing apparatus according to an embodiment of the presentinvention.

FIG. 4 is a partial enlarged view of a heater terminal connector in thesubstrate processing apparatus according to an embodiment of the presentinvention.

FIG. 5 is an explanatory diagram of a heater and its surroundingsdisposed in a substrate support in a substrate processing apparatusaccording to an embodiment of the present invention.

FIG. 6 is a schematic configuration diagram of an ICP type plasmaprocessing apparatus which is a substrate processing apparatus accordingto another embodiment of the present invention.

FIG. 7 is a schematic configuration diagram of an ECR type plasmaprocessing apparatus which is a substrate processing apparatus accordingto yet another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

As described above, when an apparatus continuously operated, theelectric resistance heating device or other parts is destroyed ordeteriorated. This is considered to be caused by a deformation of theparts during the heating process and a deterioration of the parts withtime lapse.

Hereinafter, a substrate processing apparatus with stability and highreliability despite the deformation by the heat and the deteriorationwith time lapse of the parts will be described.

(1) Configuration of Substrate Processing Apparatus

First, an example configuration of a substrate processing apparatus,which performs a method of manufacturing a semiconductor deviceaccording to an embodiment of the present invention, will be describedwith reference to FIG. 1. FIG. 1 is a cross-sectional view of an MMT(modified magnetron type) apparatus which is above-described substrateprocessing apparatus. The MMT apparatus is a plasma processing apparatusfor processing a silicon substrate 200 such as silicon wafers using anMMT plasma source that can generate a high density plasma by means of anelectric field and a magnetic field.

The MMT apparatus includes a processing furnace 202 forplasma-processing the silicon substrate 200 as the substrate. Theprocessing furnace 202 includes a processing container 203 constitutinga processing chamber 201, a susceptor 217, a gate valve 244, a showerhead 236, a gas exhaust port 235, a plasma generating mechanism (acylindrical electrode 215, an upper magnet 216 a, and a lower magnet 216b) and a controller 121.

The processing container 203 constituting the processing chamber 201includes a dome-type upper container 210 as a first container and abowl-shaped lower container 211 as a second container. The processingchamber 201 is formed by covering the lower container 211 with the uppercontainer 210. The upper container 210 is made of a non-metallicmaterial such as an aluminum oxide and the quartz, and the lowercontainer 211 is made of an aluminum.

The susceptor 217 is disposed in the bottom center of the processingchamber 201 as a substrate supporting unit for supporting the siliconsubstrate 200. The susceptor 217 is made of a non-metallic material suchas, for example, an aluminum nitride, ceramics, a the quartz to reduce ametal contamination of films formed on the silicon substrate 200. Thesusceptor 217 includes a planar substrate support 500 (see FIG. 5) forsupporting a substrate horizontally from below, and a tubular, i.e., acylindrical shaft 268 (see FIG. 1, 2) for supporting the substratesupport 500 horizontally from below.

A heater 217 b is accommodated and integrally embedded as a heating unitinside the susceptor 217 (specifically, inside the substrate support500), and is capable of heating the silicon substrate 200. A first endof a heater wire 217 c is connected to the heater 217 b. A second end ofthe heater wire 217 c is connected to a power source 218 for heaters viaa heater power supply line 219. When an electric power is supplied fromthe power source 218 for heaters via the heater power supply line 219and the heater wire 217 c, the heater 217 b is heated. Thereafter, thesurface of the silicon substrate 200 may be heated to approximately 450°C. to 900° C., for example, by radiant heat from the heater 217 b. Theheater 217 b, the heater wire 217 c and the heater power supply line 219will be described later in detail.

The susceptor 217 is electrically insulated from the lower container211. As an electrode for changing impedance, a second electrode (notshown) is mounted inside the susceptor 217. This second electrode isgrounded via an impedance variable unit 274. The impedance variable unit274 includes a coil or a variable condenser, and an electric potentialof the silicon substrate 200 may be controlled via the second electrode(not shown) and the susceptor 217 by controlling the number of patternsof the coil and a capacitance of the variable condenser.

A susceptor elevation unit (not shown) for elevating the susceptor 217is installed in the susceptor 217. A through hole 217 a is installed inthe susceptor 217. Wafer lifting pins 266 for pushing up the siliconsubstrate 200 are installed in at least three places of a bottom surfaceof the above-described lower container 211. Also, the through hole 217 aand the wafer lifting pins 266 are mutually disposed such that, when thesusceptor 217 is lowered by the susceptor elevation unit, the waferlifting pins 266 penetrate the through hole 217 a while the waferlifting pins 266 are not in contact with the susceptor 217.

The gate valve 244 is installed as a slit valve on a sidewall of thelower container 211. When the gate valve 244 is opened, the siliconsubstrate 200 may be loaded into the processing chamber 201, or thesilicon substrate 200 may be unloaded from the processing chamber 201using a transfer unit (not shown). An inner part of the processingchamber 201 may be air-tightly closed by closing the gate valve 244.

The shower head 236 for dispersing a gas supplied into the processingchamber 201 is installed in an upper part of the processing chamber 201.The shower head 236 includes a cap-shaped lid 233, a gas introductionport 234, a buffer chamber 237, an opening 238, a shielding plate 240,and a gas discharge port 239.

A gas supply pipe 232 for supplying a gas into the buffer chamber 237 isconnected to the gas introduction port 234. The buffer chamber 237functions as a dispersion space for dispersing a reactive gas 230introduced through the gas introduction port 234.

Further, the gas supply pipe 232 is connected to a nitrogen gas cylinder(not shown) for supplying an N₂ gas as a nitrogen-containing gas(reactive gas) via a valve 243 a as a switch valve and a mass flowcontroller 241 as a flow rate controller. Also, the gas supply pipe 232is connected to a hydrogen gas cylinder (not shown) for supplying a H₂gas as a hydrogen-containing gas such that the hydrogen-containing gas(reactive gas) can be supplied into the processing chamber 201.Similarly, the gas supply pipe 232 is also connected to a gas cylinder(not shown) for a noble gas such that the noble gas can be supplied as adiluent gas into the processing chamber 201. Each of the gas cylindersincludes a valve such as a switch valve. Each of the reactive gas and/orthe noble gas may be supplied into the processing chamber 201 via thegas supply pipe 232 by switching on and off these valves and the valve243 a. In general, a gas supply unit includes the gas supply pipe 232,the valve 243 a, and the mass flow controller 241.

Here, the use of the gas cylinder for each of the N₂ gas, the H₂ gas andthe noble gas is described, but the present invention is not limitedthereto. Preferably, an ammonia gas cylinder can be installed instead ofthe gas cylinders. In addition, as a ratio of nitrogen in the reactivegas increases, additional nitrogen gas cylinders may be installed.

The gas exhaust port 235 for exhausting a gas from the processingchamber 201 is provided on a sidewall of the lower container 211. A gasexhaust pipe 231 for exhausting a gas is connected to the gas exhaustport 235. An automatic pressure controller (APC) 242 as a pressureregulator, a valve 243 b as a switch valve and a vacuum pump 246 as anexhaust device are sequentially installed in the gas exhaust pipe 231from an upstream side thereof. Generally, an exhaust unit includes thegas exhaust pipe 231, the APC 242, and the valve 243 b.

The cylindrical electrode 215 is installed as a first electrode in acircumference of the processing container 203 (an upper container 210)to surround a plasma generation region 224 inside the processing chamber201. The cylindrical electrode 215 has a form of a tube, for example, acylinder. The cylindrical electrode 215 is connected to a high frequencypower source 273 for applying a high frequency power via a matching unit272 for performing an impedance matching. The cylindrical electrode 215functions as a discharge unit for exciting, by plasma, the reactive gassupplied to the processing chamber 201.

The upper magnet 216 a and the lower magnet 216 b are installed in upperand lower ends of the outer surface of the cylindrical electrode 215,respectively. The upper magnet 216 a and the lower magnet 216 b arepermanent magnets having the form of the tube, for example, thecylinder.

The upper magnet 216 a and the lower magnet 216 b include magnetic polesat both ends, i.e., an inner circumferential end and an outercircumferential end, of the processing chamber 201 along a radialdirection of the processing chamber 201. The magnetic poles of the uppermagnet 216 a and the lower magnet 216 b are disposed in oppositedirections to be disposed in up and down positions. That is, themagnetic poles in the inner circumferences of the upper magnet 216 a andthe lower magnet 216 b have different polarities. Therefore, themagnetic field in a cylindrical axis direction is formed along an innersurface of the cylindrical electrode 215.

After the reactive gas is introduced into the processing chamber 201, amagnetron discharge plasma is generated in the processing chamber 201 bysupplying the high frequency power to the cylindrical electrode 215 toform an electric field and simultaneously form the magnetic field usingthe upper magnet 216 a and the lower magnet 216 b. In this case, theemitted electrons are orbited by the above-described electromagneticfield, and thus a plasma ionization rate is increased and a plasma witha long life span and a high density may be generated.

Also, a metallic shielding plate 223 for effectively shielding anelectromagnetic field is installed around the cylindrical electrode 215,the upper magnet 216 a, and the lower magnet 216 b such that theelectromagnetic field formed by the cylindrical electrode 215, the uppermagnet 216 a, and the lower magnet 216 b cannot negatively affect anexternal environment or other devices such as a processing furnace.

Also, the controller 121 is configured as a control unit to control theAPC 242, the valve 243 b, and the vacuum pump 246 through a signal lineA, the susceptor elevation unit through a signal line B, the gate valve244 through a signal line C, the matching unit 272 and the highfrequency power source 273 through a signal line D, the mass flowcontroller 241 and the valve 243 a through a signal line E, and thepower source 218 for heaters or the impedance variable unit 274 embeddedin the susceptor through a signal line F in FIG. 1.

Subsequently, a connection unit between the heater wire 217 c and theheater power supply line 219 and its peripheral configuration will bedescribed with reference to FIGS. 2, 3, 4 and 5. FIG. 2 is a verticalcross-sectional view of the shaft 268, and FIG. 3 is a horizontalcross-sectional view of the shaft 268. Also, FIG. 3 is a horizontalcross-sectional view taken along line F-F of FIG. 2, and FIG. 2 is avertical cross-sectional view taken along line G-G of FIG. 3. FIG. 4 isa partial enlarged view of a heater terminal connector, that is, aconnection unit between the heater wire 217 c and the heater powersupply line 219. FIG. 5 is a diagram for explaining the heater 217 bdisposed inside the substrate support 500 and its peripheralconfiguration.

As shown in FIG. 5, the heater 217 b accommodated in the substratesupport 500 includes an outer heater 501 as a first heater and an innerheater 504 as a second heater. Each of the outer heater 501 and theinner heater 504 has a ring shape, and concentrically disposed such thatthe outer heater 501 can be placed in a relatively outer position andthe inner heater 504 can be placed in a relatively inner position. Aninput terminal 502 for receiving the electric power and an outputterminal 503 for outputting the electric power are installed in bothends of the outer heater 501, respectively. Also, an input terminal 505for receiving the electric power and an output terminal 506 foroutputting the electric power are installed in both ends of the innerheater 504, respectively. Each heater is heated by supplying theelectric power from the input terminals toward the output terminals.

The heater wire 217 c includes a heater wire 307 for the outer heater501 and a heater wire 308 for the inner heater 504. Each of the heaterwires 307 and 308 includes heater wires 307 a and 308 a disposed at aninput side thereof, and heater wires 307 b and 308 b disposed at anoutput side thereof. Also, the heater power supply line 219 includes anouter heater power supply line 321 (input), an outer heater power supplyline 322 (output), an inner heater power supply line 323 (input) and aninner heater power supply line 324 (output). The heater wire 307 adisposed at the input side of the heater wire 307 has a first endthereof connected to the input terminal 502 of the outer heater 501 anda second end connected to the outer heater power supply line 321(input). The heater wire 307 b disposed at the output side of the heaterwire 307 has a first end thereof connected to the output terminal 503 ofthe outer heater 501 and a second end connected to the outer heaterpower supply line 322 (output). The heater wire 308 a disposed at theinput side of the heater wire 308 has a first end thereof connected tothe input terminal 505 of the inner heater 504 and a second endconnected to the inner heater power supply line 323 (input). The heaterwire 308 b disposed at the output side of the heater wire 308 has afirst end thereof connected to the output terminal 506 of the innerheater 504 and a second end connected to the inner heater power supplyline 324 (output). A configuration of a connection mechanism between theheater wire 217 c and the heater power supply line 219 will be describedlater.

In general, a wire inserted through the shaft 268 is constituted by theheater wire 217 c, the heater power supply line 219, and theirconnection mechanism (which will be described later). Also, a first wirefor supplying the electric power to the outer heater 501 as the firstheater is generally constituted by the heater wire 307 (the heater wires307 a and 307 b), the outer heater power supply line 321, the outerheater power supply line 322, and their connection mechanisms (whichwill be described later). Also, a second wire for supplying the electricpower to the inner heater 504 as the second heater is generallyconstituted by the heater wire 308 (the heater wires 308 a and 308 b),the inner heater power supply line 323, the inner heater power supplyline 324, and their connection mechanisms (which will be describedlater).

As shown in FIG. 2, the heater wire 217 c (denoted by reference numerals307 a and 308 a in FIG. 2) is disposed inside a cylindrical shaft top301 included in the above-described shaft 268. Also, a heater powersupply line 219 (denoted by reference numerals 321 and 323 in FIG. 2) isdisposed inside a cylindrical shaft base 302 included in the shaft 268.The shaft top 301 is disposed on the shaft base 302 such that a shaftfixing member 303 can be fixed to a flange 311 of the shaft top 301, andthus the shaft top 301 is fixed to the shaft base 302. In general, theshaft 268 includes the shaft top 301, the shaft base 302, the shaftfixing member 303, and the flange 311.

Each of the wires (the heater wire 217 c, the heater power supply line219, and their connection mechanism (which will be described later)) isheld by a holder 306 as a supporting unit. Specifically, the connectionmechanism between the heater wire 217 c and the heater power supply line219 is held by the holder 306. The holder 306 is installed inside theshaft 268, particularly, inside the connection unit between the shafttop 301 and the shaft base 302, and elongated in a lengthwise directionof each wire.

A purge gas supply pipe 314 having a purge gas supply unit as a gassupply unit disposed therein is arranged between the holder 306 and aninner wall of the shaft 268 having the holder 306 installed therein(specifically, an inner wall of the shaft base 302), and arranged in thevicinity of the outer heater power supply line 321 and the outer heaterpower supply line 322, which are connected to the heater wires 307 a and307 b for the outer heater 501, respectively. More specifically, thepurge gas supply pipe 314 is installed in a position which is seen fromthe inner heater power supply line 323 and the inner heater power supplyline 324 beyond the outer heater power supply line 321 and the outerheater power supply line 322, as shown in FIG. 3. That is, the outerheater power supply line 321 and the outer heater power supply line 322are installed between the purge gas supply pipe 314 and the inner heaterpower supply lines 323 and 324.

As a gas supply mechanism for injecting a purge gas, a purge gas supplyhole 314 a is installed in an upper end of the purge gas supply pipe314. A distance between the purge gas supply hole 314 a and theconnection mechanism connected to the outer heater 501 (a connectionmechanism between the outer heater power supply lines 321 and 322 andthe heater wires 307 a and 307 b) is shorter than a distance between thepurge gas supply hole 314 a and the connection mechanism connected tothe inner heater 504 (a connection mechanism between the inner heaterpower supply lines 323 and 324 and the heater wires 308 a and 308 b).Therefore, the purge gas injected from the purge gas supply hole 314 aflows from the outer heater power supply lines 321 and 322 toward theinner heater power supply lines 323 and 324. That is, the purge gasinjected from the purge gas supply hole 314 a first purges thesurroundings of the connection mechanism between the outer heater powersupply lines 321 and 322 and the heater wires 307 a and 307 b, flowstoward the inner heater power supply lines 323 and 324 and then purgesthe surroundings of the connection mechanism between the inner heaterpower supply lines 323 and 324 and the heater wires 308 a and 308 b.When the purge gas is supplied as described above, each wire or eachconnection mechanism is cooled, and oxidation of the connectionmechanisms is simultaneously prevented.

However, the outer heater 501 and the inner heater 504 are included inthe substrate support 500 made of quartz, as described above. Since theouter heater 501 is positioned adjacent to a side surface of thesubstrate support 500, the heat is easily emitted from the side surfaceof the substrate support 500, and a temperature thereof does not riseeasily. In the substrate processing apparatus, a uniform in-planeheating of the silicon substrate 200 is required. However, since theheat is emitted from the outer heater 501 as described above, atemperature of an outer portion (outer circumferential portion) of thesilicon substrate 200 may be lower than that of an inner portion (acentral portion) of the silicon substrate 200 when a constant electricpower (the same electric power) is supplied to the inner heater 504 andthe outer heater 501. Therefore, in accordance with the embodiment, anelectric power higher than the electric power supplied to the innerheater 504 is supplied to the outer heater 501. As a result, the heatemitted from the side surface of the substrate support 500 iscompensated and achieve the uniform in-plane heating of the siliconsubstrate 200.

When the higher electric power is supplied to the outer heater 501compared to the inner heater 504, the outer heater power supply lines321 and 322 and the respective wires (the heater wires 307 a and 307 b)connected to the outer heater 501 have a higher thermal load than theinner heater power supply lines 323 and 324 and the respective wires(the heater wires 308 a and 308 b) connected to the inner heater 504,which leads to an increase in a damage caused by the thermal load. Inparticular, a temperature of the connection mechanisms between the outerheater power supply lines 321 and 322 and the heater wires 307 a and 307b rises easily and a damage rate is increased, as described later.Therefore, the respective wires connected to the outer heater 501 or theconnection mechanisms may be primarily cooled and the damage thereof maybe reduced by supplying the purge gas to flow from the outer heaterpower supply lines 321 and 322 toward the inner heater power supplylines 323 and 324 so as to first purge the surroundings of theconnection mechanisms between the outer heater power supply lines 321and 322 and the heater wires 307 a and 307 b and then purge thesurroundings of the connection mechanisms between the inner heater powersupply lines 323 and 324 and the heater wires 308 a and 308 b asdescribed above.

As shown in FIGS. 2 and 3, a first thermocouple 304 and a secondthermocouple 305 as a temperature detector are disposed together in oneside surface of the holder 306 in a position away from the connectionmechanism. A front end of the first thermocouple 304 is installed in thesubstrate support 500, and configured to measure a temperature of thesilicon substrate 200. A front end 305 a of the second thermocouple 305is fixed to the holder 306, and configured to measure a temperature ofthe holder 306.

The holder 306 is made of a material that linearly conveys atemperature, for example, ceramics, etc. Therefore, the secondthermocouple 305 may indirectly detect the temperature of the connectionmechanism between the heater wire 217 c and the heater power supply line219 by detecting the temperature of the holder 306. That is, because thetemperature of the connection mechanism is linearly conveyed, the holder306 may easily detect (estimate) the temperature (a change intemperature) of the connection mechanism by detecting the temperature(change in temperature) of the holder 306. Because the secondthermocouple 305 is installed in the position away from the connectionmechanism, the temperature of the holder 306 detected by the secondthermocouple 305 is lower than an actual temperature of the connectionmechanism.

The surroundings of the connection mechanism between the heater wire 217c and the heater power supply line 219 are heated to a very hightemperature when the heat is generated by deterioration of the parts,such as a washer 407, of the connection mechanism (see FIG. 4), as willbe described later. When the temperature is directly detected at a hightemperature, it is necessary to use a highly-priced thermocouple thatmay be used at a high temperature, which leads to an obstacle inproviding low cost apparatuses. Also, when the thermocouple is disposedin the vicinity of the connection mechanism, it is necessary to performa maintenance task at a high temperature, or perform a maintenance taskafter taking a very long cooling time. Therefore, it is not preferablein terms of maintenance. On the other hand, in accordance with theembodiment of present invention, the first thermocouple 304 is installedin the position away from the connection mechanism, and the temperatureof the holder 306 detected by the second thermocouple 305 is lower thanthe actual temperature of the connection mechanism as described above.Therefore, it is not necessary to use the highly-priced high-temperaturethermocouple as the second thermocouple 305, and thus the cost of thesubstrate processing apparatus can be reduced. Also, since the secondthermocouple 305 is used at the lower temperature, the deterioration ofthe second thermocouple 305 may be prevented and the maintenance taskthereof may be carried out without difficulty.

Also, when the temperature of the outer heater 501 or the inner heater504 is increased, the temperature of the holder 306 also increases dueto the thermal conduction or radiation. Therefore, the temperature ofthe outer heater 501 or the inner heater 504 may be indirectly detectedby detecting the temperature of the holder 306. For example, it can bejudged whether the detected temperature reaches the temperature withpossibility of damaging the outer heater 501 or the inner heater 504 bydetecting the temperature of the holder 306. Also, since the secondthermocouple 305 is installed in the position away from the outer heater501 or the inner heater 504, the temperature of the holder 306 detectedby the second thermocouple 305 is lower than an actual temperature ofthe outer heater 501 or the inner heater 504.

A temperature data detected by the second thermocouple 305 istransmitted to the controller 121. When the temperature of the holder306, that is, the indirectly detected temperature of the connectionmechanism between the heater wire 217 c and the heater power supply line219, or the indirectly detected temperature of the outer heater 501 orthe inner heater 504, exceeds a predetermined temperature, thecontroller 121 adjusts the power supply to the inner heater 504 and theouter heater 501 so as to decrease the temperature. The term‘predetermined temperature’ used herein means a temperature at which theconnection mechanism between the heater wire 217 c and the heater powersupply line 219 is not damaged, or a temperature at which the innerheater 504 or the outer heater 501 is not damaged, as will be describedlater. Such control scheme will be described later.

As shown in FIG. 3, in accordance with the embodiment of presentinvention, the first and second thermocouples 304 and 305 may also bedisposed on the side surface of the holder 306. That is, in accordancewith the embodiment of present invention, in order to dispose the firstand second thermocouples 304 and 305 adjacent to each other, throughholes may be added to the holder 306 (through holes for the first andsecond thermocouples 304 and 305 are installed, respectively), which canbe carried out easily. Also, since the first and second thermocouples304 and 305 may share a fixing means, the number of parts caneffectively reduced.

As shown in FIG. 3, a wire 310 for electrodes is also disposed on theside surface of the holder 306 according to the embodiment of thepresent invention. A first end of the wire 310 for electrodes isconnected to the impedance variable unit 274, and a second end thereofis connected to a second electrode (not shown) installed inside thesusceptor 217. As described above, the impedance of the susceptor 217(an electric potential of the silicon substrate 200) may be adjusted byadjusting the impedance variable unit 274.

As shown in FIG. 3, a partition is also installed between the respectiveheater power supply lines 219 in the holder 306 according to thisembodiment. Specifically, a partition 327 is installed between the outerheater power supply lines 321 and 322 and the inner heater power supplylines 323 and 324. Also, a partition 326 is installed between the outerheater power supply line 321 and the outer heater power supply line 322and between the inner heater power supply line 323 and inner heaterpower supply line 324 in a manner that the partition 326 crosses thepartition 327. That is, the partition 326 is installed between an inputwire and an output wire of the power supply line. Even when the wires orthe connection mechanisms are damaged, the wires are prevented fromcoming in contact with adjacent wires by the partitions. That is, anelectrical adverse effects caused by the contact with wires (such as afailure caused by excessive current flow) may be prevented.

Also, the partition 327, which is configured to oppose the flow of apurge gas, is configured to have a shorter length than the partition 326crossing the partition 327. This is for the following object in additionto the object of securing arrangement spaces of the first thermocouple304, the second thermocouple 305 and the wire 310 for electrodes. Thatis, in order to effectively supply the purge gas supplied from the purgegas supply hole 314 a to the inner heater power supply line 326 and theinner heater power supply line 327, the partitions have such a structurethat the partitions do not interfere with the flow of the purge gas.

As shown in FIG. 2, a space C1, which is defined by the shaft base 302and the shaft fixing member 303, is also present in the shaft 268 tosurround the holder 306. A cooling agent, which cools the holder 306,each of the wires and the connection mechanism in order to maintain thetemperature thereof to be under the predetermined temperature, is flownthrough the space C1.

Subsequently, the configuration of the connection mechanism between theheater wire 217 c (the heater wires 307 a, 307 b, 308 a and 308 b) andthe heater power supply line 219 (the outer heater power supply line321, the outer heater power supply line 322, the inner heater powersupply line 323, and the inner heater power supply line 324) will bedescribed with reference to FIG. 4.

The first end of the heater wire 217 c (a connection point with theheater power supply line 219) includes a planar heater wire connectionterminal 217 d. A fixing hole 401 is installed in the heater wireconnection terminal 217 d. Each of the heater wire 217 c and the heaterwire connection terminal 217 d is preferably made of anoxidation-resistant, electrically conductive material, for example,silicon carbide (SiC). The inner part of the shaft base 302 is in anatmosphere containing oxygen, and the inner part of the shaft top 301cannot be completely air-tight, and is also in the same atmospherecontaining oxygen. Therefore, the heater wire 217 c and the heater wireconnection terminal 217 d are preferably made of an electricallyconductive material which does not readily oxidize, as described above.The heater wire 217 c and the heater wire connection terminal 217 ddeteriorates when oxidized, which leads to insufficient power supply tothe heater 217 b. As a result, it is impossible to sufficiently heat thesilicon substrate 200.

A first end of the heater power supply line 219 (a connection point withthe heater wire connection terminal 217 d) includes a planar connectionterminal 402. A fixing hole 403 is installed in the connection terminal402. Each of the heater power supply line 219 and the connectionterminal 402 is preferably made of an inexpensive, oxidation-resistantand electrically conductive material such as, for example, iron ornickel.

As a thermal expansion absorption member for connecting the connectionterminal 402 with the heater wire connection terminal 217 d, a washer407 is disposed in a contacting surface between the connection terminal402 and the heater wire connection terminal 217 d. The washer 407 ispreferably made of an electrically conductive, heat-resistant material,for example a carbon material. While the connection terminal 402, thewasher 407 and the heater wire connection terminal 217 d overlap oneanother, a fastening bolt 406 is fastened to a nut 404 via the washer405 by inserting a shaft of the fastening bolt 406 from the fixing hole403 of the connection terminal 402 to the fixing hole 401 of the heaterwire connection terminal 217 d. Here, the heater wire connectionterminal 217 d and the connection terminal 402 are electrically andphysically connected to each other. In general, the connection mechanismbetween the heater wire 217 c and the heater power supply line 219 isconstituted by the connection terminal 402, the washer 407, the heaterwire connection terminal 217 d, the fastening bolt 406, the washer 405,and the nut 404.

According to the above-described configuration, although the heater wireconnection terminal 217 d and the connection terminal 402 are made ofmaterials having different coefficients of thermal expansion, the washer407 may absorb the difference in their coefficients of thermal expansionand maintain an electrical connection between the heater wire connectionterminal 217 d and the connection terminal 402 to supply desiredelectric power. Also, the damages of the heater wire connection terminal217 d or the connection terminal 402 caused by the thermal stress may beprevented.

However, the washer 407 may be considered to be oxidized since it ismade of the carbon material. When the washer 407 is oxidized, the washer407 itself is deteriorated or deformed by excessive thermal load, whichmakes it impossible to supply the desired power from the connectionterminal 402 to the heater wire connection terminal 217 d. Also,temperatures of the devices in the vicinity of the washer 407 may besuddenly increased by a contact failure, resulting in an adverse effecton the devices.

Therefore, in accordance with the embodiment of present invention, whensuch the temperature exceeds the predetermined temperature, the powersupply to the inner heater 504 and the outer heater 501 is adjusted bydisposing the second thermocouple 305 adjacent to the holder 306 andcontrolling the second thermocouple 305 to indirectly detect thetemperature of the connection mechanism between the heater wire 217 cand the heater power supply line 219 as described above. Such adjustmentis performed to prevent the excessive thermal load from being applied tothe washer 407.

(2) Method of Manufacturing a Semiconductor Device

Next, as a process of the method of manufacturing a semiconductor devicein the substrate processing apparatus according to the presentinvention, a method of nitriding a gate insulating film formed on thesilicon substrate 200 will be described in detail as an example. Inaccordance with the following description, operations of each unitconstituting an MMT apparatus are controlled by the controller 121.Here, a gate insulating film of a capacitor will be exemplified.

(Loading Process of Silicon Substrate)

The wafer lifting pin 266 is passed through the through hole 217 a ofthe susceptor 217 by lowering the susceptor 217 to a transfer positionof the silicon substrate 200. As a result, the wafer lifting pin 266 ispushed up to a predetermined height with respect to the surface of thesusceptor 217. The gate insulating film of the capacitor is formed onthe loaded silicon substrate in advance using a chemical vapordeposition (CVD) or atomic layer deposition (ALD) method using a CVD orALD apparatus. The gate insulating film is, for example, made of asilicon oxide film.

Next, the gate valve 244 is opened, and the silicon substrate 200 issupported by the wafer lifting pin 266 protruding from the surface ofthe susceptor 217 using the transfer unit (not shown). Subsequently, thetransfer unit is evacuated from the processing chamber 201, and the gatevalve 244 is shut off to close the processing chamber 201. Thereafter,the susceptor 217 is lifted using the shaft 268 and the susceptorelevation unit such as a motor (not shown). As a result, the siliconsubstrate 200 is disposed on the upper surface of the susceptor 217.Thereafter, the silicon substrate 200 is elevated to a substrateprocessing position.

(Heating Process of Silicon Substrate)

Subsequently, electric power is supplied to the heater 217 b embeddedinside the susceptor to heat the surface of the silicon substrate 200. Asurface temperature of the silicon substrate 200 is preferably set to atemperature higher than a room temperature, for example, a temperaturelower than 750° C. (a temperature at which the performances of thedevices are deteriorated). More preferably, the surface temperature ispreferably ranges from no less than 200° C. to less than 700° C.

The temperature data detected by the first thermocouple 304 is receivedby the controller 121 during a nitriding process, which will bedescribed later. Based on the temperature data received from the firstthermocouple 304, the controller 121 controls the electric power of thepower source 218 for heaters so that the silicon substrate 200 can beadjusted to a desired processing temperature.

Also, when the electric power is supplied to the heater 217 b, thetemperatures of the heater wire 217 c, the heater power supply line 219and the connection mechanism increase, and the temperature of the holder306 may also increase. In addition, when the temperature of the heater217 b is increased, the temperature of the holder 306 increases by thethermal conduction or radiation. The temperature data of the holder 306detected by the second thermocouple 305 is received by the controller121. Based on the temperature data (the temperature of the holder 306)received from the second thermocouple 305, the controller 121 controlsthe operation of the substrate processing apparatus at 3 levels: Level 1through Level 3.

(Level 1)

Level 1 is a control process which is performed when the temperature ofthe holder 306 detected by the second thermocouple 305 is a “firsttemperature” or higher.

Here, the first temperature is a temperature with possibility ofdamaging any one of the outer heater 501, the inner heater 504, and theconnection mechanism between the heater wire 217 c and the heater powersupply line 219. Further, the first temperature is not the temperatureof the outer heater 501, the inner heater 504, and the connection unit,but the temperature of the holder 306 which linearly conveys thetemperature changes thereof. The first temperature may be obtainedthrough experiments. For example, according to the experiment conductedby the inventors, the outer heater 501 or the inner heater 504 made ofSiC may be damaged when the temperature of the holder 306 is 310° C. orhigher. For example, according to the experiment conducted by theinventors, the washer 407 made of the carbon material may also bedamaged when the temperature of the holder 306 is 450° C. or higher. Inthis case, the lowest temperature (i.e., the temperature of the holder306 at which the damage of the washer 407 starts: 310° C.) among theexperimentally acquired temperatures is preferably set as the firsttemperature.

When the temperature of the holder 306 is the first temperature orhigher, the controller 121 uses a display device or alarm deviceprovided in the substrate processing apparatus to ring an alarm (forexample, display “DANGER”) so as to call an operator's attention. Also,the controller 121 stops the power supply to the outer heater 501 andthe inner heater 504 and the power supply from the high frequency powersource 273 to the cylindrical electrode 215 to stop plasma generationand interrupt processing of the production lot which is currently underway. Eventually, the operation of the substrate processing apparatus isstopped.

By performing the control process of Level 1 when the temperature of theholder 306 is the first temperature or higher as described above, thedamage of the outer heater 501 or the inner heater 504 and the washer407 can be prevented, failures of the substrate processing apparatus canbe reduced and a term between periodic maintenances period of thesubstrate processing apparatus can be extended. Further, when the firsttemperature is set to the lowest temperature among the temperature atwhich the outer heater 501 or the inner heater 504 can be damaged, andthe temperature at which the connection mechanism between the heaterwire 217 c and the heater power supply line 219 can be damaged, all thedamage of the outer heater 501, the inner heater 504, the heater wire217 c, and the heater power supply line 219 can be avoided.

(Level 2)

Level 2 is a control process which is performed when the temperature ofthe holder 306 is less than the “first temperature” but higher than orequal to “second temperature”.

Here, the “second temperature” is a temperature lower than the firsttemperature wherein the outer heater 501, the inner heater 504, and theconnection mechanism between the heater wire 217 c and the heater powersupply line 219 will probably not be damaged immediately but willdeteriorate and increasingly wear out with continuous use, or whereinthe parts are being worn out and maintenance is required before theonset of the next production lot. In addition, the second temperaturerepresents the temperature of the holder 306 which linearly conveys thechange in temperature of the outer heater 501, the inner heater 504 andthe connection unit, rather than temperatures thereof. The secondtemperature may be obtained by subtracting a predetermined temperaturefrom the first temperature. That is, when the first temperature is setto 310° C., the second temperature may be set to 300° C. obtained bysubtracting 10° C. as the predetermined temperature from 310° C. Thesubtraction of the predetermined temperature may be preferablydetermined by experiments.

When the temperature of the holder 306 is less than the firsttemperature but higher than or equal to the second temperature, thecontroller 121 uses a display device or alarm device provided in thesubstrate processing apparatus to ring an alarm (for example, display“WARNING” “Information,” etc.) so as to call the operator's attention.Also, the controller 121 continues to perform the power supply from thefrequency power source 273 to the cylindrical electrode 215 whilelowering the electric power of the power source 218 for heaters so as toreduce the temperatures of the outer heater 501 and the inner heater504. Thereafter, the controller 121 continues to perform the substrateprocessing operation. When the processing of the current production lotis completed, the operation of the substrate processing apparatus isstopped.

By performing the control process of Level 2 when the temperature of theholder 306 is less than the first temperature but higher than or equalto the second temperature as described above, an operator can beinformed in that the outer heater 501, the inner heater 504, and thewasher 407 continue to be worn out, and urge the operator to perform themaintenance task. Also, since the substrate processing apparatus is notstopped immediately, a waste of the current production lot canprevented.

(Level 3)

Level 3 is a control process which is performed when the temperature ofthe holder 306 is less than the “second temperature”. When thetemperature of the holder 306 is less than the second temperature, theouter heater 501, the inner heater 504, and the connection mechanismbetween the heater wire 217 c and the heater power supply line 219 areunlikely to be damaged immediately. Therefore, the controller 121continues to perform subsequent substrate processing operations.

(Supply of Reactive Gas)

Hereinafter, a mixture of an ammonia gas and a nitrogen gas as areactive gas will be described as an example. The mixture of the ammoniagas and the nitrogen gas is introduced in a shower pattern from the gasintroduction port 234 into the processing chamber 201. In this case, asupply quantity of the ammonia gas is adjusted to 300 sccm, and a supplyquantity of the nitrogen gas is adjusted to 300 sccm.

After the introduction of the mixture of the ammonia gas and thenitrogen gas, an inner pressure of the processing chamber 201 isadjusted to a range of 0.1 to 300 Pa, for example, 30 Pa, using thevacuum pump 246 and the APC 242.

(Excitation of the Mixture of the Ammonia Gas and the Nitrogen Gas)

After the introduction of the mixture of the ammonia gas and thenitrogen Gas, the magnetron discharge is generated in the processingchamber 201 by applying the high frequency power from the high frequencypower source 273 to the cylindrical electrode 215 via the matching unit272 and simultaneously applying the magnetic force formed by the uppermagnet 216 a and the lower magnet 216 b into the processing chamber 201.As a result, the high density plasma is generated in an upper plasmageneration region of the silicon substrate 200. In addition, theelectric power applied to the cylindrical electrode 215 ranges from 100to 1,000 W, for example, 800 W. In this case, the impedance variableunit 274 controls a level of impedance to a pre-set impedance value.

(Nitriding Process of the Gate Insulating Film)

When the mixture is in a plasma state as described above, the ammoniagas or the nitrogen gas supplied into the processing chamber 201 isactivated to be excited. Thereafter, generated nitrogen radicals (N*)and hydrogen radicals (H*) react with the gate insulating film formed onthe silicon substrate 200. During this reaction, a reduction by thehydrogen, and collision and supplement of nitrogen atoms to the surfaceof the silicon oxide film occurs. As a result, an oxygen componentreacts to form water vapor (H₂O). In addition, a high-quality gateinsulating film having a low leakage current is formed by theintroduction of nitrogen into the gate insulating film.

(Exhaust Process of Residual Gas)

When the nitriding process of the silicon oxide film is completed, thepower supply to the cylindrical electrode 215 and the gas supply intothe processing chamber 201 are stopped. Thereafter, a residual gas inthe processing chamber 201 is exhausted using the gas exhaust pipe 231.The susceptor 217 is then lowered to the transfer position of thesilicon substrate 200 to support the silicon substrate 200 disposed onthe wafer lifting pin 266 protruding from the surface of the susceptor217. Subsequently, the gate valve 244 is opened, and the siliconsubstrate 200 is unloaded from the processing chamber 201 using thetransfer unit (not shown). Thereafter, the manufacturing of thesemiconductor device according to this embodiment is finished.

(3) Effects According to this Embodiment

The embodiment in accordance with the present invention has one or morefollowing effects.

(a) According to the embodiment, the connection mechanism between theheater wire 217 c and the heater power supply line 219 is supported bythe holder 306. Also, the second thermocouple 305 is disposed on theside surface of the holder 306 away from the connection mechanism. Here,the holder 306 is made of a material which linearly conveys thetemperature, for example, ceramics. Therefore, the temperature of theconnection mechanism between the heater wire 217 c and the heater powersupply line 219 can be indirectly detected by detecting the temperatureof the holder 306.

Further, according to the embodiment, when the temperatures of the outerheater 501 and the inner heater 504 are increased, the temperature ofthe holder 306 also increases due to the thermal conduction orradiation. Therefore, the temperature of the outer heater 501 or theinner heater 504 can be indirectly detected by detecting a temperatureof the holder 306. For example, the increase in the temperature at whichthe outer heater 501 or the inner heater 504 can be damaged may bedetected by detecting the temperature of the holder 306.

That is, the holder 306 linearly conveys the temperatures of theconnection mechanism, the outer heater 501, and the inner heater 504.Therefore, the holder 306 may easily detect (estimate) the temperatures(changes in temperature) of the connection mechanism, the outer heater501, and the inner heater 504 by detecting the temperature (a change intemperature) of the holder 306 by the second thermocouple 305.

(b) In accordance with the embodiment of present invention, since thesecond thermocouple 305 is installed in the position away from theconnection mechanism (a side surface of the holder 306), the temperatureof the holder 306 detected by the second thermocouple 305 is lower thanthe actual temperature of the connection mechanism. In addition, sincethe second thermocouple 305 is installed in the position away from theouter heater 501 or the inner heater 504, the temperature of the holder306 detected by the second thermocouple 305 is lower than the actualtemperature of the outer heater 501 or the inner heater 504. Therefore,it is not necessary to use the highly-priced high-temperaturethermocouple as the second thermocouple 305, and thus the cost of thesubstrate processing apparatus can be reduced. Also, since the secondthermocouple 305 is used at the lower temperature, the deterioration ofthe second thermocouple 305 may be prevented and the maintenance taskthereof may be carried out without difficulty.

(c) According to the embodiment, when the temperature of the holder 306detected by the second thermocouple 305, that is, the indirectlydetected temperature of the connection mechanism between the heater wire217 c and the heater power supply line 219 exceeds a predeterminedtemperature, the controller 121 adjusts the power supply to the innerheater 504 and the outer heater 501 so as to decrease the temperature.More specifically, based on the temperature data (the temperature of theholder 306) received from the second thermocouple 305, the controller121 controls the operation of the substrate processing apparatus at 3levels: Level 1 through Level 3.

When the temperature of the holder 306 is the first temperature orhigher as described above, the controller 121 performs the controlprocess of Level 1. Accordingly, the damages of the outer heater 501,the inner heater 504, and the washer 407 can be avoided, the failures ofthe substrate processing apparatus can be reduced and the term betweenperiodic maintenances period of the substrate processing apparatus canbe extended. Further, when the first temperature is set to the lowesttemperature among the temperature at which the outer heater 501 or theinner heater 504 can be damaged, and the temperature at which theconnection mechanism between the heater wire 217 c and the heater powersupply line 219 can be damaged, all the damage of the outer heater 501,the inner heater 504, the heater wire 217 c, and the heater power supplyline 219 can be avoided.

When the temperature of the holder 306 is less than the “firsttemperature” and the “second temperature” or higher as described above,the controller 121 performs the above-described control process of Level2. Therefore, the operator can be informed in that the outer heater 501,the inner heater 504, and the washer 407 continue to be worn out, andurge the operator to perform the maintenance task. Also, since thesubstrate processing apparatus is not stopped immediately, a waste ofthe current production lot can prevented.

(d) According to the embodiment, the purge gas supply pipe 314 isinstalled between the holder 306 and the inner wall of the shaft 268(specifically, the inner wall of the shaft base 302) in which the holder306 is installed. The purge gas injected from the purge gas supply hole314 a first purges the surroundings of the connection mechanism betweenthe outer heater power supply lines 321 and 322 and the heater wires 307a and 307 b, flows toward the inner heater power supply lines 323 and324 and then purges the surroundings of the connection mechanism betweenthe inner heater power supply lines 323 and 324 and the heater wires 308a and 308 b. As a result, each wire or each connection mechanism iscooled, and oxidation of the connection mechanisms is simultaneouslyprevented. Further, since each of connection mechanisms or the wiresconnected to the outer heater 501 are preferentially cooled, the damageof each of the connection mechanisms or the wires connected to the outerheater 501 may be reduced when the electric power of the outer heater501 is set to a higher power level than that of the inner heater 504.

(e) The holder 306 according to the embodiment includes partitions 323and 324 installed between the heater power supply lines 219. Even whenthe wires or the connection mechanisms are damaged, the wires areprevented from coming in contact with adjacent wires by the partitions323 and 324. That is, the electrical adverse effects caused by thecontact with wires (such as the failure caused by excessive currentflow) may be prevented.

(f) According to the embodiment, the partition 327, which opposes theflow of the purge gas, is shorter in length than the partition 326 whichcrosses the partition 327. Therefore, the purge gas cab be effectivelysupplied to the inner heater power supply line 326 and the inner heaterpower supply line 327 without interfering with the flow of the purge gassupplied from the purge gas supply hole 314 a. Further, the arrangementspaces of the first and second thermocouples 304 and 305 and the wire310 for electrodes can be secured.

(g) According to the embodiment, as the thermal expansion absorptionmember for connecting the connection terminal 402 with the heater wireconnection terminal 217 d, the washer 407 is disposed in a contactingsurface between the connection terminal 402 and the heater wireconnection terminal 217 d. Therefore, although the heater wireconnection terminal 217 d and the connection terminal 402 are made ofdifferent materials, for example, the materials having differentcoefficients of thermal expansion, the washer 407 may absorb thedifference in their coefficients of thermal expansion and maintain theelectrical connection between the heater wire connection terminal 217 dand the connection terminal 402 to supply desired electric power. Also,the damages of the heater wire connection terminal 217 d or theconnection terminal 402 caused by the thermal stress may be prevented.

(h) The heater 217 b accommodated in the substrate support 500 includesan outer heater 501 as the first heater and an inner heater 504 as thesecond heater. Each of the outer heater 501 and the inner heater 504 hasthe ring shape, and concentrically disposed such that the outer heater501 can be placed in the relatively outer position and the inner heater504 can be placed in the relatively inner position. Since the outerheater 501 is positioned adjacent to the side surface of the substratesupport 500, the heat is easily emitted from the side surface of thesubstrate support 500. However, since the electric power of the outerheater 501 is set at a higher power level than the inner heater 504, theheat emitted from the side surface of the substrate support 500 iscompensated and achieve the uniform in-plane heating of the siliconsubstrate 200.

(i) According to the embodiment, the first and second thermocouples 304and 305 may also be disposed on the side surface of the holder 306. Thatis, in accordance with the embodiment of present invention, in order todispose the first and second thermocouples 304 and 305 adjacent to eachother, through holes may be added to the holder 306 (through holes forthe first and second thermocouples 304 and 305 are installed,respectively), which can be carried out easily. Also, since the firstand second thermocouples 304 and 305 may share the fixing means, thenumber of parts can effectively reduced.

(j) According to the embodiment, the space C1, which is defined by theshaft base 302 and the shaft fixing member 303, is also present in theshaft 268 to surround the holder 306. the cooling agent, which cools theholder 306, each of the wires and the connection mechanism in order tomaintain the temperature thereof to be under the predeterminedtemperature, is flown through the space C1.

Another Embodiment of the Present Invention

While the embodiment of the present invention have been describedhereinbefore in detail, it should be understood that the presentinvention is not particularly limited to the above-described embodiment,and changes and modifications may be often made without departing fromthe scope of the present invention.

For example, while the above-described example has been describedwherein the heater 217 b includes two heaters (the outer heater 501 andthe inner heater 504), the present invention is not particularly limitedto such. Therefore, the heater 217 b may include at least three heaters.

Further, the present invention is not particularly limited to theabove-described example wherein the connection mechanism between theheater wire 217 c and the heater power supply line 219 is supported frominside the holder 306. The connection mechanism may be alternatelysupported in a position spaced apart by a predetermined distance inupward and downward directions from the holder 306. Since each of theheater wire 217 c and the heater power supply line 219 is made of ametal material having a high thermal conductivity, the temperature ofthe holder 306 may be detected in such cases. Therefore, the temperatureof the connection mechanism may be indirectly detected.

In addition, while the above-described example has been describedwherein the temperature information (the absolute value) is detected bythe second thermocouple 305 and the operation of the substrateprocessing apparatus is controlled based on the absolute value, thepresent invention is not particularly limited to the above-describedexample. For example, rather than using the temperature information (theabsolute value) from the second thermocouple 305, an increased value (adifference value) of the temperature information may be detected fromthe second thermocouple 305 and the operation of the substrateprocessing apparatus may be controlled based on the increased value (thedifference value) of the temperature information

For example, when the temperature of the connection terminal 402 or theheater wire connection terminal 217 d starts to increase from a stabletemperature state (approximately 270° C.) to an abnormal level (300°C.), the difference in temperature is approximately 30° C. Here, thetemperature information (temperature at the stable state) from thesecond thermocouple 305 at a normal state is recorded. In this case,when the increased value (the difference value) of the temperatureinformation from the second thermocouple 305 is less than 20° C.compared to the temperature at the stable state, the above-describedcontrol process of Level 1 (the continued substrate processingoperation) is performed. Also, when the increased value (the differencevalue) of the temperature information from the second thermocouple 305is not less than 20° C. but less than 30° C. compared to the temperatureat the stable state, the above-described control process of Level 2 (theoperation of displaying the alarms to perform the current proceedingprocess of the production lot only) is performed. Further, when theincreased value (the difference value) of the temperature informationfrom the second thermocouple 305 is 30° C. or higher compared to thetemperature at the stable state, the above-described control process ofLevel 1 (the operation of lowering or stopping the power supply to theouter heater 501 and the inner heater 504 to stop the current proceedingprocess of the production lot) is performed.

As described above, the increased value (the difference value) of thetemperature information from the second thermocouple 305, rather thanthe temperature information (the absolute value) from the secondthermocouple 305, is detected and the operation of the substrateprocessing apparatus is controlled based on the increased value.Therefore, the operation of the substrate processing apparatus iscontrolled with a superior reproducibility, without affecting anindividual difference of the second thermocouple 305 or the substrateprocessing apparatus.

In accordance the above-mentioned embodiment, the use of the MMTapparatus has been described in detail. However, the present inventionis not particularly limited thereto. Therefore, it is possible to useother apparatuses, for example, inductively coupled plasma (ICP) orelectron cyclotron resonance (ECR) apparatuses.

FIG. 6 illustrates an ICP-type plasma processing apparatus which is thesubstrate processing apparatus according to another embodiment of thepresent invention. A detailed description of the embodiment is omittedby representing like components having the same functions with likereference numerals.

The ICP-type plasma processing apparatus 10A according to anotherembodiment of the present invention includes an induction coil 15A as aplasma generation unit for generating a plasma by supplying the electricpower. The induction coil 15A is provided outside a cell wall of theprocessing container 203. According to the embodiment, a mixture of thenitrogen gas and the noble gas is supplied from the gas supply pipe 232into the processing container 203 via the gas discharge port 239. Inaddition, when the high frequency power flows through the induction coil15A as the plasma generation unit before/after the gas supply, theelectric field is generated by the induction of electrons. The suppliedgas is transformed into the plasma using the electric field as an energysource. In this case, an active nitrogen species is generated by theplasma to nitride the gate insulating film on the silicon substrate 200.

FIG. 7 illustrates an ECR-type plasma processing apparatus that is thesubstrate processing apparatus according to yet another embodiment ofthe present invention. A detailed description of the embodiment isomitted by representing like components having the same functions withlike reference numerals.

The ECR-type plasma processing apparatus 10B having an effect on thisembodiment includes a microwave introduction pipe 17B as the plasmageneration unit for generating the plasma by supplying a microwave.According to the embodiment, a mixture gas of the nitrogen gas and thenoble gas is supplied from the gas supply pipe 232 into the processingcontainer 203 via the gas discharge port 239. A microwave 18B isintroduced into the microwave introduction pipe 17B as the plasmageneration unit before/after the gas supply, and the microwave 18B isthen injected into the processing chamber 201. The supplied gas istransformed into plasma using the microwave 18B. In this case, an activenitrogen species is generated by the plasma to nitride the gateinsulating film on the silicon substrate 200.

Preferred Embodiments of the Present Invention

Hereinafter, preferred embodiments of the present invention will bedescribed in detail.

According to one embodiment of the present invention, there is provideda substrate processing apparatus including: a processing chamber forprocessing a substrate; a heater for heating the substrate; a substratesupport accommodating the heater and installed inside the processingchamber; a shaft for supporting the substrate support; a wire insertedthrough the shaft; a supporting unit for holding the wire; and atemperature detector connected to the supporting unit.

Preferably, the wire includes: a heater wire having the heater connectedto a first end thereof and a heater power supply line connected to asecond end thereof via a connection mechanism; the connection mechanism;and the heater power supply line, and wherein the supporting unitsupports the connection mechanism.

Preferably, the heater includes a first heater disposed at an outermostside and a second heater, and wherein a gas supply mechanism isinstalled between an inner wall of the shaft and the supporting unit,and a distance between the gas supply mechanism and the connectionmechanism connected to the first heater is shorter than a distancebetween the gas supply mechanism and the connection mechanism connectedto the second heater.

Preferably, the wire includes a first wire for supplying an electricpower to the first heater; and a second wire for supplying the electricpower to the second heater, and wherein the supporting unit is providedwith a partition installed between the first wire and the second wire.

Preferably, the substrate processing apparatus further includes acontroller for controlling a power supply to the heater according to atemperature data detected by the temperature detector.

Preferably, the heater wire and the heater power supply line are made ofdifferent materials, and a thermal expansion absorption member isinstalled between the heater wire and the heater power supply line.

According to another embodiment of the present invention, there isprovided a method for manufacturing a semiconductor device using asubstrate processing apparatus, the apparatus including a processingchamber for processing a substrate; a heater for heating the substrate;a substrate support accommodating the heater and installed inside theprocessing chamber; a shaft for supporting the substrate support; a wireinserted through the shaft; a supporting unit for holding the wire; anda temperature detector connected to the supporting unit, the methodincluding steps of: (a) supporting the substrate by the substratesupport in the processing chamber; and (b) heating the substratesupported by the substrate support using the heater accommodated in thesubstrate support, and wherein the temperature detector detects atemperature of the supporting unit during the step (b).

Preferably, a controller is configured to control a power supply to theheater according to a temperature data detected by the temperaturedetector.

What is claimed is:
 1. A substrate processing apparatus comprising: aprocessing chamber configured to process a substrate; a substratesupport disposed in the processing chamber; a first heater and a secondheater accommodated in the substrate support and configured to heat thesubstrate, the first heater being disposed closer to an outer peripheryof the substrate support than the second heater; a shaft supporting thesubstrate support; a first wire inserted through the shaft, the firstwire comprising a first input-side heater power supply line, a firstoutput-side heater power supply line, a first input-side connectionmechanism, a first output-side connection mechanism, a first input-sideheater wire having a first end connected to an input terminal of thefirst heater and a second end connected to the first input-side heaterpower supply line via the first input-side connection mechanism and afirst output-side heater wire having a first end connected to an outputterminal of the first heater and a second end connected to the firstoutput-side heater power supply line via the first output-sideconnection mechanism; a second wire inserted through the shaft, thesecond wire comprising a second input-side heater power supply line, asecond output-side heater power supply line, a second input-sideconnection mechanism, a second output-side connection mechanism, asecond input-side heater wire having a first end connected to an inputterminal of the second heater and a second end connected to the secondinput-side heater power supply line via the second connection mechanismand a second output-side heater wire having a first end connected to anoutput terminal of the second heater and a second end connected to thesecond output-side heater power supply line via the second output-sideconnection mechanism; a supporting unit holding the first input-sideconnection mechanism, the first output-side connection mechanism, thesecond input-side connection mechanism, and the second output-sideconnection mechanism, the supporting unit comprising: a plate-shapedfirst partition disposed between the first input-side heater powersupply line and the second input-side heater power supply line andbetween the first output-side heater power supply line and the secondoutput-side heater power supply line, wherein the first partition isspaced apart from an inner wall of the shaft to have a gap between thefirst partition and the inner wall of the shaft; and a plate-shapedsecond partition crossing the plate-shaped first partition, theplate-shaped second partition disposed between the first input-sideheater power supply line and the first output-side heater power supplyline and between the second input-side heater power supply line and thesecond output-side heater power supply line, wherein the secondpartition is spaced apart from the inner wall of the shaft to have a gapbetween the second partition and the inner wall of the shaft; a gassupply mechanism installed between the inner wall of the shaft and theplate-shaped first partition wherein a distance between the gas supplymechanism and the both of the first input-side connection mechanism andthe first output-side connection mechanism is shorter than a distancebetween the gas supply mechanism and the both of the second input-sideconnection mechanism and the second output-side connection mechanism,wherein a gas supplied from the gas supply mechanism flows through thegap between the first partition and the inner wall of the shaft and thegap between the second partition and the inner wall of the shaft; and atemperature detector connected to the supporting unit and configured todetect a temperature of the supporting unit.
 2. The substrate processingapparatus according to claim 1, further comprising: a controllerconfigured to control a power supply to each of the first heater and thesecond heater according to a temperature data detected from thetemperature detector.
 3. The substrate processing apparatus according toclaim 1, wherein the first input-side heater wire and the firstoutput-side heater wire are made of a material different from that ofthe first input-side heater power supply line and the first output-sideheater power supply line, and the second input-side heater wire and thesecond output-side heater wire are made of a material different fromthat of the second input-side heater power supply line and the secondoutput-side heater power supply line, and wherein first thermalexpansion absorption members are installed between the first input-sideheater wire and the first input-side heater power supply line andbetween the first output-side heater wire and the first output-sideheater power supply line respectively, and second thermal expansionabsorption members are installed between the second input-side heaterwire and the second input-side heater power supply line and between thefirst output-side heater wire and the first output-side heater powersupply line respectively.
 4. The substrate processing apparatusaccording to claim 1, further comprising a controller configured toadjust a power supply to the first heater and the second heater when thetemperature of the supporting unit exceeds a predetermined temperatureto lower the temperature.
 5. The substrate processing apparatusaccording to claim 4, wherein the controller is configured to stop thepower supply to the first heater and the second heater when thetemperature of the supporting unit exceeds the predeterminedtemperature.
 6. The substrate processing apparatus according to claim 1,further comprising: a power source configured to supply an electricpower to the first heater and the second heater; and a controllerconfigured to control the power source such that the power supply to thefirst heater is higher than that to the second heater.
 7. The substrateprocessing apparatus according to claim 1, wherein the second partitionhas a width greater than that of the first partition.